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Stress and Derating Analysis

Stress & Derating Analysis

A stress and derating analysis is a detailed accounting of the applicable voltage, current, power, and thermal stress on each individual component within a device or system. Both nominal and worst case end-of-life stress calculations are made, with the worst case results using EOL component tolerances, worst case environment, and worst case operating conditions (input and loading). Transient stress conditions such as startup, current limit, short circuit, and other fault conditions are also sometimes assessed.

The calculated quantities are compared against a set of derated component ratings. The nominal stress ratios (nominal value/rating) are computed for use in the Reliability (MTBF) analysis. The derated stress ratios are also computed.

Most failures in a device or system are a direct result of subjecting components to some sort of overstress condition. This analysis is typically performed by hand, and summarized in a spreadsheet format. SPICE models or other mathematical models may be used to determine the applicable stress.

If you are going to perform one analysis to improve the reliability of your system, it should be a Stress & Derating analysis.

Download Sample Stress Report

Stress Guidelines Supported:
  • EEE-INST-002
  • IPC-9592 Class II
  • CPD-RQ-16-Y002 Rev. C
  • JPL 34885 Rev. K
  • LMCO - N2.3.5-T3-ElecEng-3.8, 817AY007502
  • TOR-4430/5236
  • SMC Standard SMC-S-010
  • ECSS-Q-ST-30-11C
  • MIL-Handbook-1547A/MIL-Std-1547B
  • MIL-STD-975M
  • MIL-STD-11991A
  • RIAC Benign/Severe
  • SMAR E032894
  • ORION

Getting a Quotation

To provide you with an accurate quotation for Stress and Derating Analysis, please fill out the form and attach any relevant documentation such as:

  • Circuit schematics
  • Bill of Materials
  • Operating conditions
  • Derating guidelines
Upload schematics, BOM, or specifications (PDF, Excel, CSV - max 10MB)
Include design details, specifications, and let us know if a Non-Disclosure Agreement is needed.